Ultra Sonic Bonding with COMPLEX Vibration by LINK-US
– Available Soon
Seika Sangyo is happy to announce a new product in the category of Bonding Devices:
The Ultrasonic Complex Vibration Bonding Machines by LINK-US will be offered through us for the European Market. This new technology can resolve existing metal welding problems!
The COMPLEX Vibration(Patented) is a technology generated with circular or elliptical vibration by adding torsional vibration to linear vibration. +The various application possibilities are best suited for the battery production processes.
More information will follow soon.
Please contact our Sales Team anytime, in case of interest: email@example.com
LINK-US WEBPAGE: https://link-us.co.jp/en/solution/