Ultra Sonic Bonding with COMPLEX Vibration by LINK-US

– Available Soon

Seika Sangyo is happy to announce a new product in the category of Bonding Devices:

The Ultrasonic Complex Vibration Bonding Machines by LINK-US will be offered through us for the European Market. This new technology can resolve existing metal welding problems!

The COMPLEX Vibration(Patented) is a technology generated with circular or elliptical vibration by adding torsional vibration to linear vibration. +The various application possibilities are best suited for the battery production processes.

More information will follow soon.

Please contact our Sales Team anytime, in case of interest: sales-d5@seika-germany.com

<strong>Comparison of methods<strong>

LINK-US WEBPAGE: https://link-us.co.jp/en/solution/

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