The HIOKI FA1813 is a horizontal double-sided flying probe tester designed for high-density bare board inspection with ultra-high precision probing. It supports simultaneous double-sided inspection using four arms, helping manufacturers inspect fine pads, package boards and advanced substrates with high reliability.
FA1813 is designed to evaluate the reliability of high-density substrates by combining precise probing technology with stable low-resistance and high-insulation-resistance measurement. The system is suitable for applications where fine pad inspection, accurate contact and reduced probe impact are important.
| Feature | Description |
|---|---|
| Ultra-high precision probing | Designed for high-density substrate inspection, fine pads and advanced package board applications. |
| Horizontal double-sided inspection | The FA1813 uses four arms, with two arms on the top side and two arms on the bottom side, enabling simultaneous double-sided testing. |
| High-speed inspection | Supports high-speed inspection at up to 76 points/sec. under specified conditions. |
| Reduced probe impact | HIOKI’s proprietary high-precision probes help minimize pattern damage while maintaining probing reliability. |
| Stable electrical measurement | Supports stable low-resistance measurement and high-insulation-resistance measurement for detecting latent defects. |
| Accurate probing support | Alignment cameras on all arms and laser board-thickness correction support accurate and stable probing. |
| Model | FA1813 |
|---|---|
| Product type | Horizontal double-sided Flying Probe Tester |
| Number of arms | 4 arms, 2 on the top side and 2 on the bottom side |
| Measurement speed | Max. 76 points/sec. |
| Testable board size | 50 mm × 50 mm to 400 mm × 330 mm |
| Maximum testable area | 398 mm × 304 mm |
| Board thickness | 0.5 mm to 2.5 mm |
| Main applications | High-density substrates, package boards, fine pad inspection and bare board reliability testing |
The HIOKI FA1813 is a horizontal double-sided flying probe tester designed for high-density bare board inspection with ultra-high precision probing.
The FA1813 is suitable for high-density substrates, package boards, fine pad applications and bare boards requiring highly accurate electrical inspection.
Yes. The FA1813 supports simultaneous double-sided inspection using four arms, with two arms on the top side and two arms on the bottom side.
The FA1813 supports high-speed inspection at up to 76 points/sec. under specified conditions.
Catalogs, technical information and model selection support are available upon request. Please contact Seika Sangyo GmbH with your company details and application requirements.
Catalogs, technical information and model selection support are available upon request.
Please contact Seika Sangyo GmbH for more details about HIOKI bare board testers.
HIOKI offers a lineup of bare board testers for various PCB inspection requirements, including high-speed open-short testing, ultra-high precision probing, probe card substrates, vertical double-sided inspection and advanced IC substrates.