The HIOKI FA1823 is a flying probe tester designed for reliable 4-wire testing of ultra-fine pads on advanced IC substrates. It enables high-precision probing for extremely small pads and bumps, making it suitable for advanced semiconductor substrates, fine-pitch boards and high-density IC substrate inspection.
FA1823 is designed to support the next generation of high-density substrate inspection. By combining simultaneous double-sided inspection, ultra-fine Kelvin probing, automatic probe calibration and low-voltage high insulation resistance testing, the system enables reliable inspection of advanced IC substrates with very fine pads and dense circuit patterns.
| Feature | Description |
|---|---|
| Ultra-fine pad inspection | Designed for reliable 4-wire testing of ultra-fine pads on advanced IC substrates. |
| Probing to Φ19 µm bumps | Supports high-precision probing to extremely small bumps when using the dedicated ultra-fine Kelvin probe. |
| Simultaneous double-sided inspection | Equipped with four arms, two on the top side and two on the bottom side, enabling simultaneous double-sided board inspection. |
| Low-voltage high insulation resistance testing | Supports high insulation resistance testing up to 100 GΩ with 10 V measurement voltage, helping reduce electrical stress on advanced IC substrates. |
| Micro-current detection technology | Newly developed PHA minute current sensing technology enables accurate detection of small currents down to 100 pA. |
| Automatic probe calibration | Auto-probe calibration automates offset acquisition during probe changeover and supports highly reproducible probe calibration. |
| Continuous inspection with loader | Supports continuous inspection in combination with a loader using the standard conveyor belt, improving efficiency for high-density board production. |
| Model | FA1823 |
|---|---|
| Product type | Horizontal double-sided Flying Probe Tester |
| Number of arms | 4 arms, 2 on the top side and 2 on the bottom side |
| Maximum testable board size | 280 mm × 260 mm, thickness up to 7.0 mm |
| Minimum size for Kelvin probe | Minimum pitch: 25 µm, minimum pad: Φ19 µm with CP1073-15 Kelvin probe |
| Minimum pad size | 1 µm with CP1075-09 |
| Maximum number of steps | 999,999 steps |
| Micro-current detection capability | 10 V, 100 GΩ / 100 pA detection |
| Inspection takt time | Max. 76 points/sec. |
| Board clamping | Two-edge holding method with automatic width adjustment |
| New functions | Auto probe calibration and auto camera height adjustment function |
Catalogs, technical information and model selection support are available upon request.
Please contact Seika Sangyo GmbH for more details about HIOKI bare board testers.
HIOKI offers a lineup of bare board testers for various PCB inspection requirements, including high-speed open-short testing, ultra-high precision probing, probe card substrates, vertical double-sided inspection and advanced IC substrates.
