FA-1240-60
The HIOKI FA1240-60 is a high-speed flying probe tester for in-circuit testing of SMT printed circuit board assemblies. It enables fixture-free electrical testing, making it suitable for prototypes, small-lot production and flexible manufacturing environments where dedicated test fixtures are not ideal.
HIOKI’s unique resistance testing and solder joint integrity tests support rapid, non-destructive evaluation of PCB assemblies. The four-terminal measurement method detects even small differences in solder quality, helping identify lifted leads, pseudo-contact and poor solder conditions.
The FA1240-60 also supports visual inspection functions and defect visualization workflows for checking component presence, polarity and displacement, while electrical testing helps verify mounting quality and solder joint integrity. With high-speed probing, precise measurement performance and test data creation from Gerber data, the FA1240-60 helps improve inspection quality while reducing preparation time and fixture costs.
The HIOKI FA1240-60 is a flying probe tester for populated board inspection after SMT assembly. It is a type of in-circuit tester that performs fixture-free electrical testing of assembled printed circuit boards, helping verify correct mounting, component connection quality and electrical defects that may be difficult to detect by visual inspection alone. With HIOKI’s 4-terminal resistance measurement technology, soft landing probing, Gerber-based data creation and defect visualization tools, the FA1240-60 supports efficient inspection of prototypes, small-lot production and high-mix electronics manufacturing. The FA1240 platform can also be applied to battery module inspection, including tab weld defect detection, wire break testing, cell voltage measurement and internal resistance testing depending on system configuration.
1. What is the HIOKI FA1240-60 used for?
The HIOKI FA1240-60 is used for electrical testing of populated printed circuit board assemblies after SMT mounting. It helps verify correct mounting, detect electrical defects and support quality assurance for assembled PCBs without requiring a dedicated bed-of-nails fixture.
2. Is the FA1240-60 a bare board tester?
No. The FA1240-60 is not a bare board tester. It is a flying probe in-circuit tester for populated PCBs and SMT board assemblies. Bare board testers inspect unpopulated PCBs before mounting, while the FA1240-60 is used after electronic components have been mounted on the board.
3. Why is electrical testing needed after SMT assembly?
After SMT assembly, visual inspection alone may not detect all electrical defects. Problems such as insufficient soldering, poor contact, lead float, electrode peeling on chip components or shorts hidden under components can be difficult to judge by appearance. The FA1240-60 uses electrical testing to help confirm the actual circuit condition and improve quality assurance.
4. What does “Program, Test and Visualize” mean?
“Program, Test and Visualize” describes HIOKI’s populated board testing workflow. Test data can be created from design data, the FA1240 performs electrical testing, and defect locations can be confirmed using visualization tools such as FAIL VISUALIZER. This workflow helps reduce preparation work and makes defect confirmation faster and easier.
5. How is test data created for the FA1240-60?
Test data can be created from electronic design data such as Gerber data, mount data and BOM information. HIOKI’s data creation workflow can automatically calculate probe contact points and test information, helping reduce manual teaching work and improve test data quality.
6. How does 4-terminal resistance measurement help?
HIOKI’s 4-terminal resistance measurement helps detect inadequate contact of IC leads and SMT connectors by measuring resistance between leads and pads. This method can help identify lead float, poor soldering and pseudo-contact conditions that may pass visual inspection or powered functional testing.
7. What is the advantage of fixture-free testing?
Fixture-free testing reduces the need for dedicated press-type fixtures for each board design. This is useful for prototypes, small-lot production, high-mix manufacturing and frequent design changes. It helps reduce fixture cost, preparation time and debugging work compared with conventional fixture-based inspection.
8. How fast is the FA1240-60?
The FA1240 series supports high-speed electrical testing, with catalog specifications indicating combination measurement from 0.025 seconds per step and testing performance up to 40 steps per second depending on the model and conditions. Actual test time depends on the board design, number of test points, test items and data creation quality.
9. Can the FA1240 platform be used for battery module inspection?
Yes. The FA1240 platform can also be applied to battery module inspection depending on system configuration. HIOKI’s four flying probes and 4-terminal measurement technology can support testing of tab weld defects, shape defects, wire breaks, cell voltage and lithium-ion battery internal resistance. This makes the technology useful not only for populated PCBs but also for EV battery module quality inspection.
10. Why choose the HIOKI FA1240-60?
The HIOKI FA1240-60 combines fixture-free in-circuit testing, HIOKI’s electrical measurement expertise, 4-terminal resistance measurement, soft landing probing, defect visualization and data creation support from design data. It is a strong solution for manufacturers that need flexible, reliable and efficient inspection of populated PCBs, prototypes, high-mix production boards and selected battery module testing applications.
Catalogs, technical information and model selection support are available upon request.
Please contact Seika Sangyo GmbH for more details about HIOKI flying probe testers.
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